Samsung may use SK Hynix’s method to manufacture HBM3 chips

According to a new report from Reuters, Samsung Electronics will soon start using the same technology as SK Hynix does to manufacture HBM3 chips. Samsung uses the non-conductive film (NCF) method to stack layers of chips in high bandwidth memory (HBM) chips. Reportedly, this method works well for chips with a lower number of layers […]

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