Samsung develops industry’s first 36GB HBM3E 12H DRAM
Samsung, the world leader in semiconductor memory chips, has announced that it has developed the industry’s first 12-stack HBM3E DRAM chip. It is the world’s highest-capacity HBM memory chip to date, and the company claims that it offers 50% higher capacity and performance than previous-generation HBM memory chips. Samsung unveils industry’s first 36GB HBM3E DRAM […]
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