Samsung to achieve finer DDR6 circuits using mSAP technology
Samsung is making strides in memory chip development as the company works diligently to bring DDR6 chips to the market. And in recent news, the Korean tech giant reportedly plans to adopt a modified Semi-Additive Process (mSAP) packaging technology for DDR6 chip production. According to Samsung VP Younggwan Ko at a recent seminar in Suwon, […]
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